Apparatus and method for use in mounting electronic elements

ABSTRACT

Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.

This application claims the benefit and is a continuation of U.S. patentapplication Ser. No. 11/380,402 to Xie Jian Hui, et al., which was filedon 26 Apr. 2006.

BACKGROUND OF THE INVENTION

The present invention relates generally to mounting electronic devices,and more particularly to surface mount devices.

FIELD OF THE INVENTION

Over the last several decades there has been a dramatic increase in thenumber and types of devices that are implemented utilizing circuitboards. The frequency with which devices and/or chips are mounted ontocircuit boards has similarly grown. Improving the mounting of devicesimproves the final product incorporating the mounted devices and cansignificantly reduce the cost and complexity of the product.

The mounting of devices can be achieved through soldering, bonding andother similar methods. Further, devices can be mounted in many differentconfigurations and/or orientations. Some devices are configured to allowone or more orientations for mounting. It can be difficult to mount someof these devices, and further the mounting of some of these devices maydeteriorate over time. As a result, the accuracy of the operation of theproduct incorporating these mounted devices can degrade and/or fail tooperate.

SUMMARY OF THE INVENTION

The present embodiments advantageously addresses the needs above as wellas other needs by providing systems, devices, methods of manufacturingand methods of mounting devices, such as mounting devices onto a circuitboard. Some embodiments provide surface mount devices that include afirst electrode comprising a chip carrier part, a second electrodedisposed proximate to the chip carrier part and separated from the chipcarrier part by an insulation gap, and a casing encasing a portion ofthe first electrode and a portion of the second electrode, where thecasing comprises a recess extending from a first surface of the casinginto the casing such that at least a portion of the chip carrier part isexposed through the recess. The first electrode can extend from the chipcarrier part toward a perimeter of the casing and project outside of thecasing, and the second electrode can extend away from the chip carrierpart and project outside of the casing. Further, the first electrodeextends from the chip carrier part toward a perimeter of the casing,divides into a first plurality of leads separated by an aperture as thefirst electrode extends from the chip carrier part toward the perimeterof the casing, the first plurality of leads join into a single firstjoined lead portion having a first width before the first electrodeprojects outside of the casing and the first electrode projects outsidethe casing as the first electrode maintains the first width outside ofthe casing, and the second electrode extends away from the chip carrierpart, attains a second width prior to projecting outside of the casing,and projects outside of the casing maintaining the second width outsideof the casing.

Some embodiments provide surface mount devices that comprises a firstelectrode comprising a chip carrier part and a plurality of leadsextending away from the chip carrier part with first and second leadsextending generally in parallel and in a first direction away from thechip carrier part and a third lead extending away from the chip carrierpart in a second direction substantially opposite the first direction; asecond electrode positioned proximate the chip carrier part andextending away from the chip carrier part; an insulation gap separatingthe second electrode from the first electrode; and a casing that encasesportions of the first and second electrodes and where the plurality ofleads of the first electrode and the second electrode protrude throughsurfaces of the casing, and the casing comprising a recess formed in thecasing such that a portion of the chip carrier part is exposed throughthe recess.

Other embodiments provide surface mount devices that comprises a firstelectrode comprising a chip carrier part; a second electrode disposed ata distance from the chip carrier part; and a casing encasing a portionof the first electrode and a portion of the second electrode, and thecasing having a recess extending from a surface of the casing into thecasing such that at least a portion of the chip carrier part is exposedthrough the recess; the first electrode extends from the chip carrierpart toward a perimeter of the casing and projects outside of thecasing, and wherein the second electrode projects outside of the casing;the first electrode is generally trapezoidal-shaped at the chip carrierpart, the first electrode comprises a plurality of leads as the firstelectrode extends from the chip carrier part toward the perimeter of thecasing, the plurality of leads having predefined widths before theplurality of leads project outside of the casing and maintaining thepredefined widths outside of the casing, and the second lead attainingan additional predefined width prior to projecting outside the casingand maintaining the additional predefined width outside of the casing.

A better understanding of the features and advantages of the presentinvention will be obtained by reference to the following detaileddescription of the invention and accompanying drawings which set forthan illustrative embodiment in which the principles of the invention areutilized.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and advantages of the presentembodiments will be more apparent from the following more particulardescription thereof, presented in conjunction with the followingdrawings wherein:

FIG. 1 depicts a perspective view of a surface mount device according tosome embodiments;

FIG. 2 depicts a partially transparent perspective view of the surfacemount device of FIG. 1, illustrating electrodes within a casing;

FIG. 3 depicts an enlarged perspective view of the electrodesillustrated in FIG. 2 without the casing;

FIG. 4 depicts a partially transparent overhead view of the of thesurface mount device of FIG. 1;

FIG. 5 depicts a perspective view of a surface mount device according tosome embodiments;

FIG. 6 depicts a partially transparent perspective view of the surfacemount device of FIG. 5, illustrating electrodes within a casing;

FIG. 7 depicts an enlarged perspective view of the electrodesillustrated in FIG. 6 without the casing; and

FIG. 8 depicts a transparent overhead view of the of the surface mountdevice of FIG. 5, illustrating the electrodes and the casing.

Corresponding reference characters indicate corresponding componentsthroughout the several views of the drawings. Skilled artisans willappreciate that elements in the figures are illustrated for simplicityand clarity and have not necessarily been drawn to scale. For example,the dimensions of some of the elements in the figures may be exaggeratedrelative to other elements to help to improve understanding of variousembodiments of the present invention. Also, common but well-understoodelements that are useful or necessary in a commercially feasibleembodiment are often not depicted in order to facilitate a lessobstructed view of these various embodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present embodiments provide apparatuses, systems, methods ofmanufacturing and methods for mounting electronic devices or elements,such as mounting an electronic element onto a circuit board. Forexample, some embodiments are particularly applicable to surface mountdevices used to mount electronic elements, such as optoelectronicdevices or elements that receive, emit, scatter and/or deflect light,and other such electronic elements. The optoelectronic elements caninclude, for example, one or more of a light emitting diode (LED), asolar cell, a photodiode, a laser diode, and other such optoelectronicelements or combinations of optoelectronic elements. Some embodiments ofthe surface mount devices are designed, at least in part, to stabilizethe electronic element and/or to dissipate heat from the electronicelement.

FIG. 1 depicts a perspective view of a surface mount device 100according to some embodiments that can be used to mount, for example, anoptoelectronic device or element. The surface mount device 100 comprisesa casing 105, a first electrode 110 and a second electrode 115. Thecasing is typically constructed of a non-conductive material, and/orthermally conductive material. In some embodiments, the casing can beformed from plastic(s), ceramic(s), and substantially any other relevantmaterial and combinations of materials. The first and second electrodes110, 115 are partially encased by the casing 105 and extend through andoutside of the casing 105. In some embodiments, after the first andsecond electrode 110, 115 are outside of the casing 105, the first andsecond electrode 110, 115 are bent generally orthogonally to the encasedportions of the first and second electrodes 110, 115 and are again bentgenerally orthogonally to extend along a first surface 135 of the casing105. The first electrode 110 includes a chip carrier part 120 where oneor more optoelectronic elements or other electronic elements can beelectrically coupled to the first electrode 110.

In some embodiments, a recess 125 is formed or defined in the casing 105extending from a second surface 130 of the casing 105 into the casing105 to the first and second electrodes 110, 115. The recess 125 canextend into the casing 105 exposing a portion of the first electrode 110and/or the second electrode 115.

FIG. 2 depicts a partially transparent perspective view of the surfacemount device 100 of FIG. 1 further illustrating portions of the firstand second electrode 110, 115 encased within the casing 105. In someembodiments, the first electrode 110 extends away from the chip carrierpart or area 120 and passes through a third surface 140 of the casing105. The second lead 115 can similarly extend away from the chip carrierpart toward a perimeter of the casing and through a fourth surface 145of the casing 105.

FIG. 3 depicts an enlarged perspective view of the first and secondelectrode 110, 115 without the casing 105 where the first and secondelectrodes are separated by an insulation gap 370. In some embodiments,the first electrode 110 includes the chip carrier part 120 that canfurther include protrusions or extensions portions 335, 340, first andsecond lead portions 320, 325 separated by an aperture 345, and a joinedlead portion 330 that, in some implementations, is further bent at thefirst bend 305 and the second bend 310. The second electrode 115 caninclude first and second lead portions 322, 327 and joined lead portion332 that, again in some implementations, is bent at the first and secondbends 307, 312. The first and second lead portions 322, 327 can includehead ends 337 and 342, respectively that are positioned juxtaposed tothe chip carrier part 120. The second electrode 115 can further includefirst and second extended portions 322, 327 extending from the first andsecond head ends 337, 342, respectively.

Referring to FIGS. 1-3, the first electrode 110 extends from the chipcarrier part 120 toward a perimeter of the casing 105. The firstelectrode 110 can be bent generally orthogonally at the first bend 305at the third surface 140 and further bent generally orthogonally at thesecond bend 310, enabling the first electrode 110 to extend along aportion of the first surface 135 of the casing 105 establishing one ormore external electrical connections. The first and second electrodes110 and 115 can be arranged in other configurations depending on ananticipated use and/or implementation. For example, the first and secondleads can pass through the third and fourth surfaces 140, 145,respectively, and continue to extend away from the casing 105 whilegradually slanting or being bent toward a plane defined by the firstsurface 135 of the casing, or other relevant configurations.

In some embodiments, the chip carrier part 120 is generallytriangular-shaped. The size and shape of the chip carrier part 120 maybe dependent upon the size and/or type of electronic element to beplaced thereon, based on the desired dissipation of heat across the chipcarrier part 120 and/or across the first electrode 110, and/or othersuch factors. The chip carrier part can be implemented through otherconfigurations and/or shapes. By way of example, the chip carrier part120 could be shaped in a variety of fashions such as trapezoidal,square, rectangular, circular or other such shapes.

According to some implementations, the first electrode 110 includes theaperture 345 defined between the first and second lead portions 320,325. As such, the first and second lead portions 320, 325 extend fromthe chip carrier part 120 and are separated by and/or form the aperture345. Further, the first and second lead portions join to form the joinedlead portion 330 forming a single lead portion prior to the firstelectrode 110 extending or projecting through the third surface 140 andoutside of the casing 105. The chip carrier part 120 can be formed of asingle lead portion 315 that widens as it extends toward the perimeterof the casing 105 and the led portions. In some embodiments, the chipcarrier part widens to form the extension portions 335, 340. In someimplementations, the chip carrier part 120 is configured to taper awayfrom a central axis 343 from an end of the chip carrier part farthestfrom the third surface 140 of the casing 105 and then extend away fromthe central axis at the extension portions 335, 340, which in someembodiments depending on intended implementation and/or electronicdevice to be utilized, can be more than about 0.4 mm from the end of thechip carrier part farthest from the third surface 140, and typicallymore than about 0.5 mm, for example, about 0.65 mm.

The first and second extension portions 335, 340 taper toward thecentral axis 343 of the first electrode 110 such that the firstelectrode 110 narrows as it splits into the two lead portions 320, 325.The aperture 345 is formed in the first electrode 110 separating thefirst and second lead portions 320, 325. Further, the aperture 345defines a boundary of the chip carrier part 120. In someimplementations, depending on intended implementation and/or the type ofelectronic device to be mounted with the chip carrier part, aperture 345can be more than about 0.6 mm from the end of the chip carrier partfarthest from the third surface 140 of the casing 105, typically morethan about 0.8 mm, for example, about 0.1 mm. The aperture 345 may, forexample, be generally square, rectangular, trapezoidal, other polygonalshape, circular, oval or substantially any other relevant other shape.Further, the width of the aperture 345, in some embodiments depending onintended implementation and/or electronic device to be utilized, can bemore than about 0.4 mm, and typically more than about 0.5 mm, forexample, about 0.7 mm. Before the first electrode 110 projects throughthe third surface 140 and outside of the casing 105, the first andsecond lead portions 320, 325 join forming the joined lead portion 330.In some implementations, the first and second lead portions 320, 325further widen, tapering away from the central axis 343 and join into thesingle joined lead portion 330 having a width 331. The first electrode110 maintains the width 331 as a constant width outside of the casing105 as the lead is bent around the casing 105.

The tapering toward the central axis 343 from the extension portions 335and 340 and the tapering of the lead portions 320, 325 away from thecentral axis can form first and second indentations 360, 365 along firstand second sides or edges 350, 355 of the first electrode 110,respectively. In some embodiments, the first and/or second indentations360, 365 defined along the first and/or second edges 350, 355 may begenerally trapezoidal and formed in the lead portions 320, 325. Thefirst and second indentation 360, 365 can be formed in other relevantshapes, such as, square, rectangular or other relevant shapes.

Still referring to FIGS. 1-3, the second electrode 115 generally extendsfrom proximate the chip carrier part 120 away from or in an oppositedirection than the first electrode 110 toward a perimeter of the casing105. The second electrode 115 is bent generally orthogonally at thefirst bend 307 and again bent generally orthogonally at the second bend312 such that the second electrode 115 wraps around the casing 105 toextend along the first surface 135 of the casing 105 to establish one ormore potential external electrical connections. In some embodiments, thesecond electrode 115 may be bent and/or arranged relative to the surfacemount device 100 in other configurations for establishing externalelectrical connections, such as those described above with respect toalternate configurations of the first electrode 110, or other relevantconfigurations.

The second electrode 115 comprises a plurality of lead portions 322, 327that extend away from the chip carrier part 320 toward the fourthsurface 145 of the casing 105. Prior to exiting the casing at the fourthsurface 145, the first and second lead portions 322, 327 join into asingle joined lead portion 332. The joined lead portion 332 has a width333 prior to exiting the casing 105. In some embodiments, the width 333is maintained as a constant width as the second electrode 115 projectsthrough the fourth surface 145 and outside of the casing 105.

The first and second lead portions 322 and 327 of the second electrode115 include the first and second head ends 337 and 342, respectively.The head ends 337, 342 are positioned proximate and/or adjacent the chipcarrier part 320 and separated from the first electrode 110 by theinsulation gap 370. Typically, the insulation gap 370 electricallyinsulates and/or separates the first and second electrodes 110, 115. Insome implementations, the insulation gap 370 has a width of betweenabout 0.1 and 0.3 mm, for example about 0.2 mm+/−0.05 mm.

In some embodiments, the first and second head ends 337, 342 are shapedsuch that edges of the head ends parallel or mimic edges of the chipcarrier part 320. By way of example, the first and second head ends 337,342 of the second electrode 115 may be generally trapezoidal-shaped suchthat the head ends parallel the extension portions 335, 340 and thegenerally triangular shape of the chip carrier part 320. In someimplementations, a portion of the chip carrier part extends between thehead ends 337, 342 as the head ends taper away from the first electrodeand toward the central axis 343. The first and second head ends furthernarrow as the lead portions 322, 327 extend away from the chip carrierpart 120 toward the fourth surface 145 of the casing 105. The leadportions 322, 327 maintain a width greater than 0.35 mm, typicallygreater than 0.4 mm, for example, greater than about 0.41 mm as theyextend from the head ends 337, 342. A spacer, inlet, void area, apertureor other separation 347 is defined or formed in the second electrode 115separating the head ends 337, and 342, and first and second extendedleads portions 322, 327 of the second electrode 115. The inlet 347 may,for example, be generally square, rectangular, trapezoidal, otherpolygonal shape, circular, oval or other relevant shapes. The inlet 347can have similar dimensions as the aperture 345, in some embodimentsdepending on intended implementation and/or electronic device to beutilized, with a width for example that is more than about 0.4 mm, andtypically more than about 0.5 mm, such as about 0.7 mm. At a terminationof the inlet 347 the first and second lead portions 322, 327 of thesecond electrode 115 merge or join together prior to the second leadextending or projecting through the fourth surface 145 and outside ofthe casing 105 forming the joined lead portion 332.

In some embodiments, the first and second lead portions 322, 327 of thesecond electrode 115 narrow defining the first and second head ends 337and 342. An interior narrowing widens the inlet 347, and an exteriornarrowing in some implementations tapers toward the central axis 343.The first and second lead portions 322, 327 further widen (e.g.,tapering) away from the central axis 343 of the second electrode 115 andjoin into the joined lead portion where the joined lead portion 332defines a termination of the inlet 347. Again, the joined lead portion332 can be configured with a width 333 prior to exiting the fourthsurface 145 of the casing, and in some instances maintains that width332 as a constant width as the second electrode extends along the thirdsurface 145 and the first surface 135 of the casing 105.

The tapering in toward the central axis 343 and tapering out away fromthe central axis 343 along a first edge 352 of the second electrode 115defines a first indentation 362, and in some instances may have agenerally trapezoidal shape. Similarly, a second indentation 367 isformed along a second edge 357 of the second electrode 115 that, in someimplementations, has a generally trapezoidal shape. The first and secondindentation 362, 367 of the second electrode 115 can be formed in otherrelevant shapes, such as square, rectangular or other shapes.

The insulation gap 370 is defined between the first electrode 110 andthe second electrode 115. Typically, the first electrode 110 iselectrically isolated and/or separated from the second electrode 115 bythe insulation gap. The insulation gap 370 separates the chip carrierpart 320 from the head ends 337, 342 of the first and second leadportions 322, 327. The width of the gap 370 can be substantially anywidth, and typically is dependent on the electrical device or element tobe coupled with the chip carrier part 320, the voltage, current and/orpower level of operation of the surface mount device 100, the intendedimplementation of the surface mount device 100, the material of thefirst and second electrodes, and other relevant factors or combinationsof factors.

FIG. 4 depicts a partially transparent overhead view of the surfacemount device 100, transparently illustrating the casing 105 so that thefirst and second electrodes 110, 115 are visible through the casing 105,according to some embodiments. The recess 125 in some implementations isgenerally conical in shape and includes a wall 402 that tapers from anouter perimeter of the recess at the second surface 130 of the casing105 to an interior perimeter of the recess 410 at about the first andsecond electrodes 110, 115. As such, at least a portion of the first andsecond electrodes 110, 115 are exposed through the recess 125. Further,portions of the casing surrounding the exposed portions of theelectrodes and within the interior perimeter 410 of the recess 125 arealso exposed through the recess 126. The embodiment of FIG. 4 depictsportions of the first and second electrode 110, 115, portions of theinsulation gap 370, a first portion of the aperture 345, and a firstportion of the inlet 347 extending into and being exposed through therecess 125.

The insulation gap 370, the aperture 345, the inlet 347 and theindentation 360, 365, 362, 367, in addition to apertures in some otherembodiments, are void or vacant of lead material. The recess 125 and/orthe first and/or second electrodes 110, 115 may be variously designed orconfigured to expose different regions of the electrodes and/or casing.In some embodiments, a fill material is incorporated into the recess 125that fills at least some of the recess 125 in the casing 105, andtypically covers those portions of the first and second electrodes 110,115 extending into the interior perimeter 410 of and exposed through therecess. The fill material may also, at least partially, cover and/orfill those portions of the insulation gap 370, the first portion of theaperture 345, and first portion of the inlet 347 that also extended intothe interior perimeter 410 and are exposed through the recess 125.

An electronic element (e.g., optoelectronic element) is typicallycoupled with and/or supported by the first electrode 110 at the chipcarrier part 120. The electronic element is further coupled with thesecond electrode 115 through a connection (e.g., a bond wire or othersuch connection). Further, the electronic element typically is at leastpartially exposed through the recess 125. Some implementations includethe fill material that fills at least some of the recess 125 in thecasing 105, and typically surrounds and/or covers the electronicelement, the exposed portions of the first and second electrodes 110,115, and the electrical connection(s) between the electronic element andthe electrodes. The fill material may also, at least partially, coverand/or fill portions of the insulation gap 370, the aperture 345, andinlet 347 that extend into and are exposed through the recess 125.

The first and second electrodes 110, 115 are typically made fromelectrically conductive material. In some embodiments, the electrodematerial is also thermally conductive to assist, at least in part, indrawing heat away from the electronic and/or optoelectronic element. Thechip carrier part 120 of the first electrode 110 may be configured, inpart, to support and electrically couple with the optoelectronicelement. The optoelectronic element is coupled to the chip carrier partor area 120 in one of many ways, such as with an adhesive, coating,film, encapsulant, solder, paste, grease and/or other such methods.These coupling mechanisms may be thermally as well as electricallyconductive.

Similarly, the optoelectronic element is coupled to the second electrode115 through one or more similar methods. For example, in someembodiments the optoelectronic element is electrically coupled to thesecond electrode 115 through a wire connection. Additionally oralternatively, the optoelectronic element may be partially supported by,and coupled to the first electrode 110, and extend over the insulationgap 370 to couple with the first and/or second head end 337, 342 of thesecond electrode 115.

In some embodiments, the first electrode 110 is coupled to a cathodeportion of the optoelectronic element and is defined as the cathode leadof the surface mount device 100. Further, the second electrode 115 iscoupled to an anode portion of the optoelectronic element and is definedas the anode of the surface mount device 100. Thus, the insulation gap370 between the first electrode 110 and the second electrode 115provides, for example, an electrical separation and/or insulationbetween the anode and cathode of the surface mount device 100.

The casing 105 of the surface mount device 100 encases a portion of thefirst and second electrodes 110, 115. In some embodiments, the casing105 is generally cubical in shape. However, the casing 105 may havesubstantially any relevant shape, including having multiple portionswhere a first portion includes a pair of supports or legs. The casing105 can further include markings indicating the type of device,orientation and/or pin numbering.

In some methods of manufacturing, the optoelectronic element is coupledto the first and second electrodes 110, 115 prior to constructing thecasing 105. Alternatively, the optoelectronic element may be coupled tothe electrodes after the first and second electrode 110, 115 arepartially encased within the casing 105. Thus, in some embodiments, thecasing 105 may be configured with the recess 125 that extends into thecasing exposing a sufficient area of at least the chip carrier part 120to receive, mount and secure the optoelectronic element within therecess 125.

The recess 125 is, in part, shaped to expose at least a portion of theoptoelectronic element, such that when coupled to electrodes theoptoelectronic element in some implementations may emit and/or receivelight. The recess 125 is, for example, shaped, formed, cut, molded, orconstructed into substantially any shape relevant to the application ofthe surface mount device 100. In some embodiments, the recess 125 isgenerally a conical shape. Alternatively, other shapes, or portions ofshapes, can be implemented for the recess 125, such as generallycylindrical, cubical, semi-spherical, octagonal, pyramidal, parabolic,and other relevant shapes. The recess 125 may, at least in part,facilitate the distribution and/or absorption of the lightemitted/received from/by the optoelectronic element. In someembodiments, the shape of the recess 125 works in conjunction with thefill material deposited in the recess 125.

The fill material is implemented, in some embodiments, to provide atleast some protection of the exposed optoelectronic element.Additionally, the fill material can, in part, enhance thedistribution/absorption of light for the optoelectronic element. Thefill material can be formed from one or more of a resin, an epoxy, athermoplastic polycondensate (e.g. a polyphthalamide (PPA)), a plastic,glass, nylon and/or other such relevant materials and/or combinations ofmaterials. In some embodiments, additional materials are added to thefill material to enhance the emission, absorption and/or dispersion oflight to and/or from the optoelectronic element.

Still referring to FIGS. 1-4, the first and second electrodes 110, 115are partially encased by the casing. In some embodiments, the thicknessof the first electrode 110 and/or second electrode 115 is substantiallyeven in thickness and flat along a least a portion of the lengths of theelectrodes encased in the casing. The encased portions of the first andsecond electrodes 110, 115 generally lay along the same plane. Forsimplicity, portions of the casing 105 along a plane defined by surfacesof the first and second electrodes 110, 115 that are opposite or faceaway from the recess are referred to below as being “beneath” the leadelement, and the portion of the casing 105 “above” the plane created bythe first and second electrodes 110, 115 are referred to as being“above” the lead element. In some implementations, the casing material,fill material and/or other material (e.g., epoxy, resin, adhesive, andother such relevant material) extend partially into and/or through oneor more of the vacant areas including, but not limited to, the aperture345, inlet 347, insulation gap 370, through holes, indentations 360,365, 362, 367, beveled corners and/or other recesses or areas vacant ofelectrode material. For example, those vacant areas encased by thecasing can be at least partially filled with casing material, one ormore pegs from the casing extending through the vacant areas and othersuch configurations.

The aperture 345, inlet 347 and the insulation gap 370 (referred togenerally as vacant areas) are partially encased by the casing 105 andfurther extend into the interior perimeter 410 and exposed through therecess 125. For example, an encased portion of the vacant areas exposethe casing beneath the vacant areas to the casing material above thevacant areas, and casing material or other connections or materialextend through at least portions of the vacant areas. Further, theportions of the casing 105 below an exposed or un-encased portions ofthe vacant areas are exposed through the recess 125, and in someimplementations, the un-encased portions of the vacant areas are furthercovered or filled with fill material. The configuration of the first andsecond electrodes 110, 115, with the aperture 345, inlet 347 andinsulation gap 370, in part, increases surface bonding areas around theelectrodes including the casing beneath the electrodes exposed by thevacant areas to bond with the fill material and/or casing material abovethe electrodes and/or extending through the vacant areas.

The enhanced bonding provided through and around the first and secondelectrodes 110, 115, at least in part, enhances the stability of thefirst and second electrode 110, 115 relative to the casing 105 and thestructural integrity of the surface mount device 100. The structuralintegrity is further maintained, at least in part, through theelectrodes 110, 115 adhering to the casing 105, the fill material,and/or the optoelectronic element. In some embodiments, however, thebonding or adhesion between casing material, and/or between casingmaterial and fill material is greater than the bonding or adhesionestablished between the casing and the electrodes, and between theelectrodes and the fill material.

Further, during use in some implantations the electrodes can increase intemperature and this increase in temperature can cause deterioration inthe adhesion or bonding between the electrodes and the casing, and/orbetween the electrodes and the fill material. Poor adhesion betweencomponents of the surface mount device 100 may lead to a deteriorationof the device. For example, poor adhesion between the electrodes 110,115 and the casing 105 may allow the electrodes 110, 115 to shift insidethe surface mount device 100. A shifting of the electrodes 110, 115 maylead to an incorrect positioning of the optoelectronic element, adeterioration of the device 100, and/or may eventually lead to failure.Some embodiments increase the areas of adhesion between the casing aboveand below the electrodes and between the fill material and the casing105 further contributing to maintaining the configuration and structuralintegrity of the surface mount device 100.

The aperture 345, inlet 347, insulation gap 370, and/or indentations360, 362, 365, 367 increase the adhesion areas around the electrodes110, 115, and in part facilitate the securing of the positioning of thefirst and second electrodes 110, 115 and the optoelectronic elementrelative to the casing 105 and/or recess 125. Further, by incorporatingcasing material and/or fill material into the aperture 345, inlet 347and insulation gap 370, the relative positioning of the chip carrierpart 120 and/or optoelectronic element are more precisely maintained.Still further, the relative angles of tapering, the shape of theaperture 345, inlet 347 and indentations 360, 362, 365, 367, extensionportions 335, 342, and/or head ends 337, 342 allow casing and/or fillmaterial to be positioned around the electrodes to enhance the stabilityof positioning of the electrodes relative to the casing and/or recess125. The increased stability of the optoelectronic element furtherimproves performance of the surface mount device 100 and increasesreliability of the surface mount device 100. In some embodiments, theadhesion capacity between the components of the surface mount device 100is further enhanced by increasing the surface area of the casing exposedthrough the recess 125. For example, the diameter of the recess 125 atthe surface of the chip carrier part 120 could be increased to exposethe casing 105 outside of the chip carrier part 120. However, the casingreal estate available for the recess 125 is limited, and a change in therecess 125 may affect the emission/absorption of the light from/by theoptoelectronic element.

Furthermore, in some implementations mounting devices 100 may besubjected to environments with relatively high heat and/or vibration.Accordingly, the shape of the first and/or second electrode 110, 115and/or the recess 125 are designed in some embodiments to, at least inpart, increase the adhesion areas around and/or through the electrodes110, 115 of the surface mount device 100. Further, at least the aperture345, inlet 347 and insulation gap 370 (vacant areas) further maintainpositioning of the chip carrier part 120 relative to the casing 105 andthus increase stability of the electronic element and/or optoelectronicelement. An increase in adhesion areas of the casing at least in partincreases the stability of the components and secures positioning suchthat the devices can be accurately and reliably utilized in adverseconditions including relatively high heat and/or subject to relativelylarge amounts of vibration.

Additional vacant areas may be included in the electrodes according tosome embodiments to, at least in part, further increase the adhesionareas through and/or around the electrodes 110, 115 maintain thepositioning of the electrodes 110, 115 within the casing. Additionalvacant areas through holes or bores and can extend through the first orsecond electrodes 110, 115. These through holes can be circular, square,rectangular, triangular, irregular, or other relevant shapes orcombination of shapes. Vacant areas may be formed or fashioned throughmany different methods, such as molded, bored, drilled, etched, punchedout, cut, filed, or other such methods and/or combinations of methods.

As described above, the first and second electrodes 110, 115 may have apoor adhesion capacity with the casing material and/or fill material.Direct coupling of the casing material through the vacant areas to thecasing 105 above and beneath the vacant areas of the electrodes 110, 115at least in part further secures the positioning of the electrodes 110,115 within the surface mount device 100. Additionally or alternatively,an adhesive material can be utilized to at least partially fill theaperture 345, inlet 347 and insulation gap 370, or additional vacantareas, to adhere the casing 105 and/or fill material above the first andsecond electrodes 110, 115 to the casing 105 beneath the electrodes. Theadhesive material could be substantially any relevant material thatadheres to the casing and/or fill material, such as glue, epoxy, resin,and other types of relevant adhesive material.

The casing 105 can be formed and/or assembled through one or moremethods. In some embodiments, the casing 105 is formed or molded aroundthe electrodes 110, 115. Additionally or alternatively the casing can bemolded into sections, for example, a top and a bottom. Each section mayincorporate molding that facilitates, in part, securing the electrodeswith the sections of the casings. The top and bottom portions aresecured together, sandwiching portions of the first and secondelectrodes 110, 115. The top and bottom sections are secured together,for example, with adhesive material, peg and slots, snap fit, springbiasing, lever arms, friction fit, and or other relevant methods. Inother embodiments, a base section may be pre-molded allocating space forthe electrodes 110, 115 to be secured onto the base of the casing 105,and a top section of the casing 105 is formed, molded or poured over theelectrodes 110, 115.

For example, the top portion of the casing can be formed by pouringcasing material over the top of a portion of the electrodes that arecoupled to a base section. In this example, the vacant areas not exposedby the recess 125 are covered by and/or at least partially filled inwith, casing material. Portions of the insulation gap 370 and beveledcorners not exposed through the recess 125 may also be at leastpartially filled by the casing material. In other embodiments, thebottom of the casing 105 is molded such that casing material beneath theelectrodes extends through the vacant areas (e.g., aperture 345, inlet347, insulation gap 370, and/or beveled corners) to mate or cooperatewith a top portion of the casing 105 above the electrodes. In someimplementations, the bottom portion can include pegs that extend throughthe vacant areas to couple with slots in the casing opposite the peg. Inother embodiments, the vacant areas contain adhesive material thatsecures sections of the casing 105 together about the first and secondelectrodes 110, 115. Further, the indentations 360, 365, 362, 367provide for additional bonding of the casing material above and belowthe electrodes 110, 115.

In some embodiments of manufacturing, the fill material is a liquid orsemi-liquid and is poured into the recess 125 of the casing 105. Thefill material adheres to the casing 105 beneath the first and secondelectrode 110, 115 through the exposed portion of the vacant areas.Exposed portions of the vacant areas are covered by and/or at leastpartially filled with fill material. The fill material adheres to thecasing 105 beneath the electrodes 110, 115 exposed by vacant areaswithin the interior perimeter 410 of the recess 125.

FIG. 5 depicts a perspective view of a surface mount device 500according to some embodiments that can be used to mount, for example,one or more electronic elements. The surface mount device 500 comprisesa casing 505, a first electrode 510 and a second electrode 515. Thecasing includes a recess 525 formed in a first surface 530. The casing,in some embodiments, is similar to the casing as described above withreference to FIGS. 1-4. The first and second electrodes 510, 515 arepartially encased by the casing 505 and extend through second and thirdsurfaces 535, 540 of the casing and outside of the casing 505. The firstand second electrodes 510, 515 are typically constructed of electricallyconductive material, and in some implementations, are further thermallyconductive. The first electrode 510 includes a chip carrier part 520where one or more electronic elements or devices, such as optoelectronicelements can be positioned and coupled with the first electrode 510.

The recess 525 is formed or defined in the casing 505 extending from thefirst surface 530 of the casing 505 into the casing 505 to the first andsecond electrodes 510, 515. In some embodiments, the recess 525 extendsinto the casing 505 to expose a portion of, at least one of, the firstelectrode 510 and/or the second electrode 515.

FIG. 6 depicts a partially transparent perspective view of the surfacemount device 500, with the first and second electrode 510, 515 visiblewithin the casing 505. In some embodiments, after the first and secondelectrode 510, 515 extend through the second and third surfaces 535, 540and are exterior to the casing 505, the first and second electrodes 510,515 are bent generally orthogonally to the encased portions of the firstand second electrodes 510, 515 to extend generally parallel with thesecond and third surfaces and again are bent generally orthogonally toextend along a portion of the fourth surface 545 of the casing 505.

FIG. 7 depicts an enlarged perspective view of the first and secondelectrodes 510, 515 separated by an insulation gap 770. The firstelectrode 510 includes the chip carrier part 520, and first, second andthird leads 720, 725 and 726, respectively, extending from the chipcarrier part. The second electrode 515 includes a head end 742 and alead portion 727 extending from the head end. The first electrode 510,in some embodiments, is configured with a plurality of leads 720, 725,726 to enhance the dissipation of heat from the chip carrier part 520.Still further, the chip carrier part 520 can have an increased area oversome other surface mount devices to further aid in dissipating heat froman electronic element cooperated with the first electrode. As such, thesurface mount device 500 may be utilized more with higher powerelectronic devices or element than can be employed in some other surfacemount devices.

In some embodiments, the first and second electrodes 510, 515 the first,second and third leads 720, 725 and 726 of the first electrode 510include bends 705, 706 and 708, respectively, where the leads are bentgenerally orthogonally and further include bends 710, 711 and 713,respectively, where again the leads are bent generally orthogonally.Similarly, the lead portion 727 of the second electrode 515 can includea first bend 707 such that the second electrode bends generallyorthogonally and a second bend 712 that again bends the electrodegenerally orthogonally. Bending the leads 720, 725, 726 and 727establishes one or more external electrical connections. In someembodiments, the first and/or second electrodes 510, 515 may be bentand/or arranged relative to the surface mount device 500 in othersconfigurations as are known in the art for establishing an externalelectrical connection.

Referring to FIGS. 5-7, the chip carrier part 520 in someimplementations is generally trapezoidally shaped. The chip carrierpart, however, can be configured in substantially any relevant shape. Byway of example, the chip carrier part 520 could be shaped in a varietyof fashions such as trapezoidal, square, rectangular, circular or otherrelevant shapes. The size and shape of the chip carrier part 520 may bedependent upon the size and/or type of electronic element to be placedthereon, upon the desired dissipation of heat across the chip carrierpart 520 and/or across the first electrode 510, and/or other suchfactors.

The first electrode 510 can be configured as a single contiguous piece715 forming the chip carrier part 520 and splitting into the first,second and third leads 720, 725, 726 as the first electrode 510 expandsor extends away from the chip carrier part 520 and toward a perimeter ofthe casing 505 before the first electrode 510 projects outside of thecasing 505. In some embodiments, the plurality of leads 720, 725 and 726of the first electrode are generally “h” shaped or backward “h” shaped.Further in some embodiments, the first and second electrodes 510, 515are configured in a generally “H”-shaped formation, with two leads,e.g., first and second leads 720, 725, extending from the chip carrierpart 520 in generally a first direction, and the third lead 726 and thelead portion 727 of the second electrode 515 extending generally in asecond direction that is approximately opposite the first direction. Insome instances, the first lead 720 and third lead 726 of the firstelectrode 510 are axially aligned and extend way from the chip carrierpart at about 180 degrees relative to each other, while the first andsecond leads 720, 725 are generally parallel as they extend from thechip carrier part.

The chip carrier part 520 widens as the chip carrier part extends towardand into the first and second leads 720, 725. In some embodiments, thesingle contiguous piece 715 at the chip carrier part 520 may widen as itextends from the chip carrier part 520 toward a perimeter of the casing505. The widening can include extension or wing portions 734 and 740.The width and/or length of the extension portions 734, 740 can depend onthe size of the chip carrier part 520, the electronic element to becooperated with the chip carrier part, heat dissipation capabilities ofthe first electrode 510, material of the first electrode and/or othersuch factors. In some implementations, an extension indentation 746divides the first extension portion 734 into to first and secondextension sections 735 and 737. The extension indentation 746 betweenthe first and second extension sections 735, 737 of the first extensionportion 734 is void of electrode material and has a width 784. The width784 of the first extension portion can depend on many factors such asthose described above. Further, the extension indentation 746, in someimplementations, further aids in maintaining relative positioning of thefirst electrode 510 and/or maintaining the structural integrity of thesurface mount device 500 as described below. The extension indentation746 can be generally square, polygonal, circular, triangular, or otherrelevant shapes or combinations of shapes. The width 784 of theextension indentation 746, in some embodiments depending on intendedimplementation, is greater than about 0.3 mm, in some instances greaterthan about 0.4 mm, for example, 0.5 mm.

In some embodiments, the first extension section 735 of the firstextension portion 735 narrows as it tapers toward a central axis 738(indicated by the dotted line labeled with the reference number 738)along a first edge 750 extending toward and/or into the first lead 720.Similarly, the second extension section 737 of the first extensionportion 735 narrows as it tapers toward the central axis 738 along asecond edge 750 extending to the third lead 726. Further, the secondextension portion 740 can narrow tapering toward the central axis of thefirst electrode 510 along a third edge 755 as chip carrier part 520extends toward and/or into the second lead 725. As such, the firstelectrode 510 generally narrows as it splits into the first, second andthird leads 720, 725, 726.

The first and second leads 720, 725 extend from the chip carrier part520 and are separated by a lead gap, indentation, void area or opening745. The lead gap 745 may, for example, be generally square,rectangular, trapezoidal, other polygonal shape, circular, oval or otherrelevant shape. The lead gap 745 has a width 748 that in someimplementations is proportional to the width of the first and secondleads 720, 725, the area of the chip carrier part 520, the electronicelement anticipated to be utilized with the surface mount device 500,and/or other relevant factors. In some embodiments, the lead gap 745 hasa width greater than about 0.5 mm, for example, about 0.7 mm+/−0.05 mm.

In some embodiments, the first lead 720 and/or second lead 725 of thefirst electrode 510 increase in width prior to projecting through thesecond surface 535 and outside of the casing 505 to first and secondwidth 781 and 782, respectively. The first and second widths can bemaintained as a constant width as the leads exit the casing and extendalong the second and fourth surfaces of the casing. Typically, the firstwidth 781 is about equal to the second width 782. The first and secondwidths 781, 782 are predefined widths based on one or more factors suchas, the electronic element to be cooperated with the chip carrier part520, the size of the casing 505, the lead gap 745 and/or other suchfactors. In some embodiments, the first and second leads 720, 725maintain widths greater than about 0.35 mm, typically greater than about0.4 mm, for example, greater than about 0.41 mm. In someimplementations, the first and second leads 720, 725 widen to the firstand second widths 781, 782 tapering away from the central axis 738 ofthe first electrode 510 along the first edge 750 and the third edge 755,respectively, prior to extending through the second surface 535 of thecasing 505. The first and second widths 781, 782 can be dependent onmany factors as described above, and in some implementations are greaterthan about 0.5 mm, for example, greater than about 0.7 mm.

In some implementations, the third lead 726 of the first electrode 510that extends away from the chip carrier part 520 in a directiongenerally opposite the first lead 720 can also widen to a third width783, tapering along the second edge 752 away from the central axis 738widening the lead 726 to the third predefined width 783 prior to thethird lead extending through the third surface 540 and outside of thecasing 505. The third lead can maintain the width 783 as it extendsalong the third and fourth surfaces 540, 545 of the casing 505. Thewidth can be dependent on one or more factors such as the electronicelement to be cooperated with the chip carrier part 520, the size of thecasing 505, material of the first electrode and/or other such factors.In some instances, the widths 781-783 are substantially equal. In someembodiments, the third lead 726 is configured to maintain a widthgreater than about 0.35 mm, typically greater than about 0.4 mm, forexample, greater than 0.41 mm, and widens to width 783 that is greaterthan about 0.5 mm, for example, greater than about 0.7 mm.

The tapering along the first edge 750 toward the central axis 738 of thefirst extension section 735 and the tapering away from the central axisof the first lead 720 defines a first lead indentation 760 of the firstelectrode 510. Similarly, a second lead indentation 762 can be definedalong the second edge 752 due to the tapering toward the central axis738 of the second extension sections 737 and the tapering away from thecentral axis of the third lead 726, and a third lead indentation 765 canbe defined along the third edge 755 due to the tapering toward thecentral axis 738 of the second extension portion 740 and the taperingaway from the central axis of the second lead 725. In someimplementations, the first, second and/or third lead indentations 760,762, 765 can be generally trapezoidal in shape. Other shapes, however,can be employed, such as, but not limited to square, rectangular orother relevant shape.

The second electrode 515 includes a head end 742 that is positionedjuxtaposed with the chip carrier part 520 of the first electrode 510separated from the first electrode by the insulation gap. A lead 727 ofthe second electrode 515 extends from the head end 742 proximate thechip carrier part 520 toward and through the third surface 540 of thecasing 505. In some implementations, the lead 727 is bent generallyorthogonally at a first bend 707 and further bent generally orthogonallyat a second bend 712, enabling the second electrode 515 to extend alongportions of the third and fourth surfaces 540, 545 of the casing 505 toestablish one or more external electrical connections. The secondelectrode 515 may be bent and/or arranged relative to the surface mountdevice 500 in other configurations as are known in the art forestablishing an external electrical connection.

In some embodiments, a portion of the head end 742 of the secondelectrode 515 parallels or mimics an adjacent portion of the chipcarrier part 520 of the first electrode 510. For example, edges of thehead end can parallel at least a portion of edges of the secondextension portion 740 and taper toward the central axis 738 parallelinga portion of an edge of the chip carrier part 520. The head end 742narrows as the second electrode 515 extends away from the chip carrierpart 520 toward the third surface 540 of the casing 505. The head end742 can taper along a first edge 757 generally toward the central axis738 extending into the lead portion 727 of the second electrode 515. Thesecond electrode can further narrow along a second edge 758 away fromthe central axis 738. In some implementations, the narrowing along thesecond edge 758 is a substantially perpendicular narrowing. Prior to thelead portion 727 of the second electrode extending through the thirdsurface 145 of the casing 505, the second electrode 515 widens to awidth 785. The widening of the second electrode can be implemented bytapering the electrode along the first edge 757 away from the centralaxis 738. A lead indentation 767 is formed by the narrowing at the headend 742 and widening of the lead 727 along the first edge 757. In someembodiments, the indentation 767 is generally conical and/or trapezoidalin shape. In some implementations, the width of the lead 727 of thesecond electrode 515 is maintained to be greater than about 0.35 mm,typically greater than about 0.4 mm, for example, greater than 0.41 mm,while the width 785 in some implementations is greater than about 0.5mm, for example, greater than about 0.7 mm.

The second electrode 515 is further positioned relative to the firstelectrode 510 such that the lead 727 of the second electrode isseparated from the third lead 726 of the first electrode by a lead gap,inlet or void area 747. The lead gap 747 may, for example, be generallysquare, rectangular, trapezoidal, other polygonal shape, circular, ovalor other relative shapes. In some embodiments, the lead gap 747 ismaintained as the second electrode 515 and the third lead 726 of thefirst electrode 510 extend through and along the third surface 540 ofthe casing such that the second electrode and the third lead of thefirst electrode are generally parallel. The lead gap 747 can havedimensions, in some implementations, similar to those of the lead gap745 with a width greater than about 0.5 mm, for example, about 0.7mm+/−0.05 mm. Further, the distance between the lead gaps 745, 747 candefine a chip carrier part length, that in some embodiments depending onintended implementation and/or electronic device to be incorporated canbe greater than about 0.8 mm, and in some instances greater than about1.0 mm, for example, about 1.2 mm.

The insulation gap 770 separates the chip carrier part 520 of the firstelectrode 510 from the head end 742 of the second electrode 515. Theinsulation gap 770 typically electrically isolates the first electrode510 from the second electrode 515. The width and/or size of theinsulation gap 770 can be substantially any relevant size and istypically dependent on the electrical and/or optoelectronic element tobe coupled with the chip carrier part 520, the voltage, current and/orpower level of operation of the surface mount device 500, the intendedimplementation of the surface mount device 500, the material of thefirst and second electrodes, other relevant factors or combinations offactors. In some embodiments, the insulation gap 770 has a width ofbetween about 0.1 and 0.3 mm, for example about 0.2 mm+/−0.05 mm.

FIG. 8 depicts a transparent overhead view of the surface mount device500, illustrating the first and second electrode 510, 515 positionedrelative to the casing 505, according to some embodiments. The recess525 is illustrated showing those portions of the first electrode 510including those portions of the chip carrier part 520, and the secondelectrode 515 exposed through the recess according to some embodiments.The outer perimeter 805 of the recess 520 is defined by an intersectionof the first surface 530 of the casing 505 and the recess 525. Theinterior perimeter 810 of the recess is defined by an intersection ofthe first and second electrode 510, 515 and the recess 525. Typically,those portions of the casing 505, first electrode 510 and secondelectrode 515 within the interior perimeter 810 is exposed through therecess 525. The embodiment of FIG. 8 depicts portions of the first andsecond electrode 510, 515, portions of the insulation gap 770, portionsof the lead gaps 745, 747 and portions of the extension indentation 746being exposed by the recess 525.

In some embodiments, a fill material (not shown) is added to the recess525 to at least partially cover and/or fill one or more of the firstelectrode 510, the second electrode 515, the insulation gap 770, thelead gaps 745, 747 and the extension indentation 746. Extending portionsof the lead gaps 745, 747 and the extension indentation 746 furtherincrease the surface area of the casing 505 that is exposed through therecess 525 and to fill material incorporated into the recess. Thisincreased surface area can enhance the bonding of the fill material withthe casing and around the first and second electrodes 510, 515. Allowingfill material and/or casing material to extent through the lead gaps745, 747, extension indentation 746 and/or insulation gap 770, enhancesthe stability of the positioning of the first and second electrodes 510,515. For example, portions of the lead gaps 745, 747 can allow casingmaterial to extend between and around the first and second electrodes tofurther fix the positioning of the electrodes relative to the casing,and further the fill material can extend through and/or around the firstand second electrodes through the portions of the lead gaps 745, 747,extension indentation 746 and the insulation gap 770 that extend intoand are exposed through the recess to still further fix the positioningof at least the chip carrier part 520 of the first electrode 510 and thehead end 742 of the second electrode 515 relative at least to the recess525. Other benefits and advantages are provided by the surface mountdevice 500, including some or all of those described above regardingbonding of casing material and fill material, stability and operabilityof surface mount devices gained by exposing at least portions of vacantregions, the methods of manufacturing as described above, and otherbenefits. Exposing portions of vacant regions (e.g., portions of theinsulation gap 770, the lead gaps 745, 747, and extension indentation746) through the recess 525 can aid in the stability and operability ofthe surface mount device 500. Further, vacant regions and areas aroundthe perimeter of the electrodes encased by the casing 505 can providefurther increased stability due at least in part to casing material,fill material and/or adhesive material extending through at leastportions of the vacant regions and areas around the electrodes tostabilize the positioning of the electrodes relative to the casingand/or recess.

While the invention herein disclosed has been described by means ofspecific embodiments and applications thereof, numerous modificationsand variations could be made thereto by those skilled in the art withoutdeparting from the scope of the invention set forth in the claims.

1. A surface mount device, comprising: a casing comprising a firstsurface; a recess formed in said first surface and extending at leastpartially into said casing; and a plurality of electrodes at leastpartially encased by said casing, wherein one of said electrodescomprises a first electrode with a chip carrier part at least partiallyexposed through said recess; said first electrode dividing into a firstplurality of leads as it extends away from said chip carrier part towardthe perimeter of said casing, with said first plurality of leads joininginto a single joined lead portion before said first electrode portionprojects outside of said casing.
 2. The device of claim 1, whereinanother of said plurality of electrodes comprises a second electrodeproximate said first electrode and separated from said chip carrier partby an insulation gap.
 3. The device of claim 2, wherein said secondelectrode extends away from said chip carrier part, attains a secondwidth prior to projecting outside said casing, and maintains said secondwidth outside said casing.
 4. The device of claim 1, wherein said singlejoined lead portion has a first width before said first electrodeprojects outside said casing, said first electrode maintaining saidfirst width outside said casing.
 5. The device of claim 1, wherein saidfirst plurality of leads are separated by an aperture as said firstelectrode extends from said chip carrier part to the perimeter of saidcasing.
 6. The device of claim 5, wherein said first electrode ispositioned relative to said casing such that said portion of the chipcarrier part and a first portion of said aperture are exposed throughsaid recess.
 7. The device of claim 6, wherein casing material formingsaid casing extends through a second portion of said aperture notexposed through said recess.
 8. The device of claim 6, furthercomprising a fill material disposed within at least a portion of saidrecess such that at least a portion of said fill material extends intosaid first portion of said aperture.
 9. The device of claim 2, whereinsaid second electrode comprises a second plurality of leads separated byan inlet and is positioned relative to said casing such that a portionof each of said second plurality of leads and a first portion of saidinlet are exposed through said recess.
 10. The device of claim 9,further comprising a fill material extending into said first portion ofsaid inlet, and casing material extending through a second portion ofsaid inlet not exposed by said recess.
 11. The device of claim 1,wherein said first electrode widens as it extends from said chip carrierpart toward the perimeter of said casing, narrows as it splits into saidfirst plurality of leads, and widens as said first plurality of leadsjoin into said first joined lead portion before said first electrodeprojects outside said casing.
 12. The device of claim 11, furthercomprising: a first indentation along a first edge of said firstelectrode; and a second indentation along a second edge of said firstelectrode, said first and second indentations defined by the widening ofsaid chip carrier part, the narrowing of said plurality of leads, andthe widening of said first joined lead portion.
 13. The device of claim2, wherein said second electrode comprises a second plurality of leads,with each of said leads comprising a head end proximate said chipcarrier part such that an edge of each said head ends is parallel to theedges of said chip carrier part, and a portion of said chip carrier partextends between said head ends.
 14. The device of claim 13, wherein saidsecond plurality of leads join into a second joined lead portion beforesaid second electrode projects outside said casing, with said secondelectrode widening as said second plurality of leads join into saidsecond joined lead portion.
 15. The device of claim 2, wherein saidinsulation gap between said first electrode and said second electrode isformed by edges of said second electrode paralleling edges of said chipcarrier part.
 16. The device of claim 2, wherein said first electrodeand said second electrode in combination are generally H-shaped.
 17. Thedevice of claim 1, further comprising one or more electronic and/oroptoelectronic devices coupled with at least one of said plurality ofelectrodes and at least partially exposed through said recess.
 18. Asurface mount device, comprising: a casing comprising a first surface; arecess formed in said first surface and extending at least partiallyinto said casing; and a plurality of electrodes at least partiallyencased by said casing, wherein one of said electrodes comprises a firstelectrode with a chip carrier part at least partially exposed throughsaid recess; said first electrode comprising a plurality of leadsextending away from said chip carrier part, with a first and second ofsaid leads generally extending in a first direction away from said chipcarrier part, and a third lead extending in a second direction away fromsaid chip carrier part.
 19. The device of claim 18, wherein another ofsaid plurality of electrodes comprises a second electrode proximate saidchip carrier part and separated from said first electrode by aninsulation gap.
 20. The device of claim 19, wherein said first andsecond leads are separated by a first lead gap, and said third lead andsaid second electrode are separated by a second lead gap.
 21. The deviceof claim 20, wherein said first and second electrodes are positionedrelative to the casing such that a portion of said chip carrier part, aportion of said isolation gap, a portion of said first lead gap, and aportion of said second lead gap extend are exposed through said recess.22. The device of claim 18, wherein said chip carrier part furthercomprises an extension portion and an extension indentation formed insaid extension portion, such that a portion of said extensionindentation is exposed through said recess.
 23. The device of claim 22,further comprising a fill material filling at least a portion of saidrecess and extending into a portion of said insulation gap, a portion ofsaid first lead gap, a portion of said second lead gap and a portion ofsaid extension indentation that are exposed through said recess.
 24. Thedevice of claim 18, further comprising one or more electronic and/oroptoelectronic devices coupled with at least one of said plurality ofelectrodes and at least partially exposed through said recess.
 25. Asurface mount device, comprising: a casing comprising a first surface; arecess formed in said first surface and extending at least partiallyinto said casing; and a plurality of electrodes at least partiallyencased by said casing, wherein at least one of said electrodes dividesinto a plurality of leads; one or more of said electrodes and said leadscomprising one or more gaps between them, with at least a portion of atleast one of said gaps exposed through said recess.
 26. The device ofclaim 25, wherein at least one of said electrodes comprises a chipcarrier part at least partially exposed through said recess.
 27. Thedevice of claim 25, wherein exposing said gaps through said recessoptimizes the stability and operability of the surface mount device. 28.The device of claim 25, wherein said gaps not exposed through saidrecess optimize the stability of the surface mount device by one or moreof casing material, fill material, and adhesive material extendingthrough at least portions of the gaps and areas around said electrodes.29. A surface mount device, comprising: a casing comprising a recessextending at least partially into said casing; and a plurality ofelectrodes at least partially encased by said casing, wherein at leastone of said electrodes comprises a portion exposed through said recess,at least one of said electrodes comprising one or more stabilizingfeatures to secure the positioning of said electrodes relative to saidcasing.
 30. The device of claim 29, wherein a portion of at least one ofsaid electrodes not encased by said casing passes over at least twosurfaces of said casing.
 31. The device of claim 29, wherein saidelectrodes comprise a thermally conductive material for drawing heataway from an electronic element mounted on at least a portion of one ofsaid electrodes.
 32. The device of claim 29, wherein said one or morefeatures comprises one or more apertures.
 33. The device of claim 29,wherein said one or more features comprises one or more inlets.
 34. Thedevice of claim 29, wherein said one or more features comprises one ormore gaps.
 35. The device of claim 29, wherein said one or more featurescomprises one or more indentations.
 36. The device of claim 29, whereinsaid one or more features comprises one or more angled surfaces.
 37. Thedevice of claim 29, wherein said one or more features comprises one ormore extension portions.
 38. The device of claim 29, wherein said one ormore features comprises one or more head ends.